Cu2+
- CAS:
- Other names:
- SMILES: [Cu++]
Properties
| MW | HBA | HBD | LogP | TPSA | Rot. | Comp. | Fsp3C | Brutto formula |
|---|---|---|---|---|---|---|---|---|
| None | None | None | None | None |
Availability
| Suppliers | Supplier IDs | Storage | Storage ID | Quantity | Class | Added |
|---|---|---|---|---|---|---|
| JN_399 | None | Jan. 1, 2023 |
Bar codes
| Plate barcode | Sample barcode |
|---|---|
PAINS
| Identified PAINS |
|---|
Supramolecules
| Name | log K | SD | pH | T(°C) | Method | Ref |
|---|---|---|---|---|---|---|
| [6A-(3-Aminopropylamino)-6A-deoxy-BCD](1).[Cu2+] | 7.35 | 0.04 | 25.0 | pH titration | Stephen F. Lincoln 1994 | |
| [protonated form of 6A-(3-Aminopropylamino)-6A-deoxy-BCD](1).[Cu2+] | 3.09 | 0.04 | 25.0 | pH titration | Stephen F. Lincoln 1994 | |